AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in application environments.
MATERIAL
: Aluminum NitrideCOLOR
: GreyDENSITY
: 3.30 g/cm3THERMAL CONDUCTIVITY
: > 170 W/m.KMAX. SERVICE TEMPERATURE
: 1200 degree CTYPICAL ADVANTAGES
: High Thermal Conductivity▼Introduction to Aluminum Nitride Ceramics
AlN(Aluminum Nitride) Ceramic has excellent thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in application environments. These materials are available in both lapped and "as fired" condition as well as metalized and non-metalized substrates.
▼Properties of Aluminum Nitride(AlN) Ceramic :
| ✔Excellent in insulation properties |
✔High thermal conductivity |
| ✔Excellent in thermal shock resistance |
✔Good smoothness / flatness |
| ✔Small dielectric constant |
✔Thermal expansion coefficient similar to silicon |
| ✔Excellent resistance against oil / acid / alkali |
✔... |
▼Typical Applications of Aluminum Nitride(AlN) Ceramic :
| ✔LED packages |
✔Power modules |
| ✔Wafer bonding |
✔Heater base material |
| ✔Substrate for chip resistors |
✔HIC substrate/plate for heat dissipation |
| ✔Electrostatic suction cup (ESC) |
✔The radio frequency component of the radar system |
▼Material Thermal Conductivity Performance Comparison Table :
▼Material Coeffecient of Expansion Performance Comparison Table :
AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in application environments. MATERIAL : Aluminum Nitride COLOR : Grey DENSITY : 3.30 g/cm3 THERMAL CONDUCTIVITY : > 170 W/m.K MAX. SERVICE TEMPERATURE : 1200 degree C TYPICAL ADVANTAGES : High Thermal Conductivity
Details
DPCs consist of a ceramic substrate such as Al2O3 (aluminium oxide) and AlN (Aluminum Nitride) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling. MATERIAL Al2O3 / AlN DENSITY 3.30-3.70 g/cm3 COLOR white / grey
Details
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