AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. NOVATEK offers a series of substrates based on AlN materials for use in application environments.
Material
: Aluminum NitrideColor
: GreyDensity
: 3.30 g/cm3Thermal Conductivity
: > 175 W/m.KMax. Service Temperature
: 1200 degree CTypical Advantages
: High Thermal ConductivityWhen it comes to providing good thermal conductivity and high electrical insulation features, aluminum nitride substrate is a superb option because of its efficacy. Aluminum nitride sheets are widely used in the semiconductor application industry instead of beryllium oxide (BeO) since aluminium nitride is non-toxic and does not produce dangerous vapors when grinded and machined. Aluminum nitride ceramic substrate has a thermal expansion and isolation coefficient which closely matches the silicon wafer product, making it useful in applications in electronics that often have high temperatures and heat dissipation problems.
| √ Small Dielectric Constant | √ Good Mechanical Strength |
| √ High Thermal Conductivity | √ Good Smoothness / Flatness |
| √ Excellent in Electrical Insulation | √ Excellent in Thermal Shock Resistance |
| √ Thermal Expansion Coefficient Similar to Silicon | √ Excellent Resistance against Oil, Acid and Alkali |
| ITEM | UNIT | ALN |
| Main Content | - | AlN > 95% |
| Density | g/cm3 | > 3.3 |
| Color | - | Grey |
| Water Absorption | % | 0 |
| Warpage | - | < 2‰ |
| Standard Surface Roughness (Ra) | um | 0.3 - 0.6 |
| Flexural Strength | Mpa | 440 |
| Thermal Conductivity (25 °C) | W/m.K | > 175 |
| Thermal Expansion Coefficient (25 - 300 °C) | 10-6 mm/°C | 2 - 3 |
| Thermal Expansion Coefficient (300 - 800 °C) | 10-6 mm/°C | 2.5 - 3.5 |
| Max. Working Temperature | °C / °F | 1,200 / 2,190 |
| Dielectric Strength | KV/mm | > 17 |
| Dielectric Constant | 1 MHz | 17 |
| Electrical Resistivity (25 °C) | Ω·cm | > 1014 |
∆ The data is offered for reference only, exact data will vary depending on producing method and part configuration.
| Length and Width | Thickness | Tolerance (Thickness) |
| 110mm x 110mm (4.3" x 4.3") | 0.25mm (0.010") | ±0.03mm(<1.0mm) |
| 114mm x 114mm (4.5" x 4.5") | 0.38mm (0.015") | ±0.05mm(1.0mm - 1.5mm) |
| 120mm x 120mm (4.7" x 4.7") | 0.50mm (0.020") | ±0.07mm(>1.5mm) |
| 127mm x 127mm (5.0" x 5.0") | 0.63mm (0.250") | ±0.10mm(>2.0mm) |
| 130mm x 140mm (5.1" x 5.5") | 0.76mm (0.030") | |
| 109mm x 130mm (4.3" x 5.1") | 1.00mm (0.390") | Tolerance (Length and Width) |
| 190mm x 140mm (7.5" x 5.5") | 2.00mm (0.790") | +0.25mm/-0.05mm |
∆ Customized dimensions are available. Laser cutting service can be provided and make customized shapes and holes.
| ● LED Packages | ● Power Modules |
| ● Wafer Bonding | ● Heat Dissipation Substrate |
| ● Substrate for Chip Resistors | ● HIC Substrate/Plate for Heat Dissipation |
| ● FAX Substrates for Thermal Printer Head | ● ...More |
Aluminum nitride heating ceramic plates are heating elements or heater carriers made using aluminum nitride ceramics as the substrate or core component. MATERIAL Al2O3 / AlN DENSITY 3.30-3.70 g/cm3 COLOR white / grey Can be customized according to your requirements.
Details
AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. NOVATEKXM offers a series of substrates based on AlN materials for use in application environments. MATERIAL : Aluminum Nitride COLOR : Grey DENSITY : 3.30 g/cm3 THERMAL CONDUCTIVITY : > 170 W/m.K MAX. SERVICE TEMPERATURE : 1200 degree C TYPICAL ADVANTAGES : High Thermal Conductivity Can be customized according to your requirements.
Details
DPCs consist of a ceramic substrate such as Al2O3 (aluminium oxide) and AlN (Aluminum Nitride) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling. MATERIAL AlN / Al2O3 DENSITY 3.30-3.70 g/cm3 COLOR white / grey Can be customized according to your requirements.
Details
DPCs consist of a ceramic substrate such as Al2O3 (aluminium oxide) and AlN (Aluminum Nitride) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling. MATERIAL Al2O3 / AlN DENSITY 3.30-3.70 g/cm3 COLOR white / grey
Details
AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. NOVATEK offers a series of substrates based on AlN materials for use in application environments. Material : Aluminum Nitride Color : Grey Density : 3.30 g/cm3 Thermal Conductivity : > 175 W/m.K Max. Service Temperature : 1200 degree C Typical Advantages : High Thermal Conductivity Can be customized according to your requirements.
Details
AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. Novatek offers a series of substrates based on AlN materials for use in application environments Material:Aluminum Nitride Color: Grey Density: 3.30 g/cm3 Thermal Conductivity: > 170 W/m.K Max. Service Temperature: 1200 degree C Typical Advantages: High Thermal Conductivity Can be customized according to your requirements.
Details
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