AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. Novatek offers a series of substrates based on AlN materials for use in application environments
Material:Aluminum Nitride
Color: Grey
Density: 3.30 g/cm3
Thermal Conductivity: > 170 W/m.K
Max. Service Temperature: 1200 degree C
Typical Advantages: High Thermal Conductivity Can be customized according to your requirements.
When it comes to providing good thermal conductivity and high electrical insulation features, aluminum nitride substrate is a superb option because of its efficacy. Aluminum nitride sheets are widely used in the semiconductor application industry instead of beryllium oxide (BeO) since aluminium nitride is non-toxic and does not produce dangerous vapors when grinded and machined. Aluminum nitride ceramic substrate has a thermal expansion and isolation coefficient which closely matches the silicon wafer product, making it useful in applications in electronics that often have high temperatures and heat dissipation problems.
All substrates are grinded with surface roughness Ra0.3-0.6. We can also do surface polishing, one-side polishing or double-side polishing with surface roughness Ra0.02-0.05.
DPCs consist of a ceramic substrate such as Al2O3 (aluminium oxide) and AlN (Aluminum Nitride) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling. MATERIAL AlN / Al2O3 DENSITY 3.30-3.70 g/cm3 COLOR white / grey Can be customized according to your requirements.
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AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in application environments. MATERIAL : Aluminum Nitride COLOR : Grey DENSITY : 3.30 g/cm3 THERMAL CONDUCTIVITY : > 170 W/m.K MAX. SERVICE TEMPERATURE : 1200 degree C TYPICAL ADVANTAGES : High Thermal Conductivity Can be customized according to your requirements.
Details
AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. NOVATEK offers a series of substrates based on AlN materials for use in application environments. Material : Aluminum Nitride Color : Grey Density : 3.30 g/cm3 Thermal Conductivity : > 175 W/m.K Max. Service Temperature : 1200 degree C Typical Advantages : High Thermal Conductivity Can be customized according to your requirements.
Details
Aluminum nitride heating ceramic plates are heating elements or heater carriers made using aluminum nitride ceramics as the substrate or core component. MATERIAL Al2O3 / AlN DENSITY 3.30-3.70 g/cm3 COLOR white / grey Can be customized according to your requirements.
Details
AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. Novatek offers a series of substrates based on AlN materials for use in application environments Material:Aluminum Nitride Color: Grey Density: 3.30 g/cm3 Thermal Conductivity: > 170 W/m.K Max. Service Temperature: 1200 degree C Typical Advantages: High Thermal Conductivity Can be customized according to your requirements.
Details
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